JPH0749823Y2 - 回路基板 - Google Patents
回路基板Info
- Publication number
- JPH0749823Y2 JPH0749823Y2 JP10150489U JP10150489U JPH0749823Y2 JP H0749823 Y2 JPH0749823 Y2 JP H0749823Y2 JP 10150489 U JP10150489 U JP 10150489U JP 10150489 U JP10150489 U JP 10150489U JP H0749823 Y2 JPH0749823 Y2 JP H0749823Y2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- electrode land
- circuit board
- component
- conductor layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004020 conductor Substances 0.000 claims description 22
- 239000000758 substrate Substances 0.000 claims description 9
- 229910000679 solder Inorganic materials 0.000 description 7
- 239000006071 cream Substances 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10150489U JPH0749823Y2 (ja) | 1989-08-30 | 1989-08-30 | 回路基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10150489U JPH0749823Y2 (ja) | 1989-08-30 | 1989-08-30 | 回路基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0339877U JPH0339877U (en]) | 1991-04-17 |
| JPH0749823Y2 true JPH0749823Y2 (ja) | 1995-11-13 |
Family
ID=31650453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10150489U Expired - Lifetime JPH0749823Y2 (ja) | 1989-08-30 | 1989-08-30 | 回路基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0749823Y2 (en]) |
-
1989
- 1989-08-30 JP JP10150489U patent/JPH0749823Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0339877U (en]) | 1991-04-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH08321671A (ja) | バンプ電極の構造およびその製造方法 | |
| JPH0749823Y2 (ja) | 回路基板 | |
| JPH0745980Y2 (ja) | 回路基板 | |
| JPH0621628A (ja) | 印刷配線板 | |
| JPH03252193A (ja) | 配線基板 | |
| JPH0637431A (ja) | 表面実装用基板のランドパターン | |
| JPH1051094A (ja) | プリント配線板及びその製造方法 | |
| JPH02122594A (ja) | 回路基板装置 | |
| JPH0143877Y2 (en]) | ||
| JP2795475B2 (ja) | プリント配線板及びその製造方法 | |
| JP2743524B2 (ja) | 混成集積回路装置 | |
| JPH0138924Y2 (en]) | ||
| JPH0590764A (ja) | 電子部品搭載用基板の製造方法 | |
| JPH03233995A (ja) | チップ部品の実装方法 | |
| JPH03185788A (ja) | 電気回路形成方法 | |
| JPH0691310B2 (ja) | 配線基板の製造方法 | |
| JPS60194556A (ja) | 抵抗多層印刷基板 | |
| JPH0728118B2 (ja) | 面付け実装プリント配線板の製造方法 | |
| JPH0385793A (ja) | 厚膜配線板の外部端子形成方法 | |
| JPS61144049A (ja) | 混成集積回路用基板 | |
| JPH0286186A (ja) | プリント配線板 | |
| JPS62114474U (en]) | ||
| JPH07142825A (ja) | 過電流耐性を有する回路パターンの構造 | |
| JPH02185096A (ja) | 厚膜多層回路基板 | |
| JPH0832210A (ja) | プリント配線基板の半田ランド形成方法 |